Semiconductor device manufacturing apparatus and manufacturing method

ABSTRACT

An apparatus for manufacturing semiconductor devices includes: a cabinet having an opening section on a front surface thereof; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in an air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a ventilation system that introduces the air atmosphere or oxygen into the cabinet; a lock system that is capable of locking the front door in a closed state; and a detector that detects oxygen concentration within the cabinet, wherein the lock system unlocks the front door when the oxygen concentration detected by the detector becomes a predetermined value or higher.

BACKGROUND

1. Technical Field

Several aspects of the present invention relates to apparatuses and methods for manufacturing semiconductor devices.

2. Related Art

In manufacture and development of semiconductor devices, the steps of heating, drying and storing products, semi-products and trial products are frequently performed. These steps may be automatized, thereby eliminating manual handling. However, in the case of batch processings, which are frequently conducted, the aforementioned steps may be performed manually.

Apparatuses such as an oven (heating/drying furnace) and a desiccator (a storage container) are generally used when semiconductor devices are heated, dried and stored. Depending on the type of semiconductor devices, these steps may be conducted in the apparatuses while gas with a low oxygen concentration is flowed or sealed inside the apparatuses (in an oxygen-deficient atmosphere). For example, Laid-open Utility Patent Application 05-055550 is an example of related art.

When the operators perform the steps of heating, drying and storing semiconductor devices in an oxygen-deficient atmosphere, while using an oven and a desiccator, there are dangers of suffocation of the operators. For this reason, a lock may often be provided on the door of the oven, but the lock alone cannot eliminate the danger associated with misoperations by the operators, and drastic countermeasures are demanded.

SUMMARY

In accordance with an advantage of some aspects of the invention, it is possible to provide semiconductor device manufacturing apparatuses and semiconductor device manufacturing methods using the apparatuses which are highly safe to the operators.

An apparatus for manufacturing semiconductor devices in accordance with an embodiment of the invention includes: a cabinet having an opening section on its front surface; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in the air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a ventilation system that introduces the air atmosphere or oxygen into the cabinet; a lock system that is capable of locking the front door in a closed state; and a detector that detects an oxygen concentration within the cabinet, wherein the lock system unlocks the front door when the oxygen concentration detected by the detector becomes a predetermined value or higher.

The apparatus for manufacturing semiconductor devices described above can reduce the possibility of unexpected accidents such as suffocation of the operator.

An apparatus for manufacturing semiconductor devices in accordance with another embodiment of the invention includes: a cabinet having an opening section on its front surface; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in the air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a ventilation system that introduces the air atmosphere or oxygen into the cabinet; a lock system that is capable of locking the front door in a closed state; and a timer that starts time measurement upon operation of the ventilation system, wherein the lock system unlocks the front door when a time measured by the timer elapses a predetermined time.

The apparatus for manufacturing semiconductor devices described above can reduce the possibility of unexpected accidents such as suffocation of the operator.

An apparatus for manufacturing semiconductor devices in accordance with an embodiment of the invention includes: a cabinet having an opening section on its front surface; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in the air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a mesh door that is provided at the opening section of the cabinet in a manner to be freely opened and closed, and provided inside the front door; a detector that detects an oxygen concentration within the cabinet; and a lock system that is capable of locking the mesh door in a closed state, wherein the lock system unlocks the mesh door when the oxygen concentration detected by the detector becomes a predetermined value or higher.

The apparatus for manufacturing semiconductor devices described above can reduce the possibility of unexpected accidents such as suffocation of the operator.

An apparatus for manufacturing semiconductor devices in accordance with an embodiment of the invention includes: a cabinet having an opening section on its front surface; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in the air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a mesh door that is provided at the opening section of the cabinet in a manner to be freely opened and closed, and provided inside the front door; a timer that starts time measurement upon opening the front door; and a lock system that is capable of locking the mesh door in a closed state, wherein the lock system unlocks the mesh door when a time measured by the timer elapses a predetermined time.

The apparatus for manufacturing semiconductor devices described above can reduce the possibility of unexpected accidents such as suffocation of the operator.

In the apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention, an alarm device may be provided instead of the lock system, wherein the alarm device may alarm when the oxygen concentration detected by the detector becomes a predetermined value or higher.

In the apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention, an alarm device may be provided instead of the lock system, wherein the alarm device may alarm when the time measured by the timer reaches a predetermined time.

The apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention may be provided with a ventilation system for introducing the atmosphere or oxygen into the cabinet.

In the apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention, the ventilation system may include at least one of a compressed air jet nozzle and an air atmosphere intake port equipped with a suction fan.

In the apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention, the ventilation system may include an exhaust fan provided at the gas exhaust port.

In the apparatus for manufacturing semiconductor devices in accordance with an aspect of the invention, the exhaust fan may be provided at a position higher than a position of the air atmosphere intake port within the cabinet.

A method for manufacturing semiconductor devices in accordance with an embodiment of the invention includes the step of applying a heat treatment, using any one of the manufacturing apparatuses described above.

As a result, the possibility of unexpected accidents such as suffocation of the operator can be reduced, and semiconductor devices can be very safely manufactured.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a semiconductor device manufacturing apparatus 100 in accordance with an embodiment of the invention.

FIG. 2 is a schematic perspective view of a semiconductor device manufacturing apparatus 100 in accordance with an aspect of the embodiment of the invention.

FIG. 3 is a schematic perspective view of a semiconductor device manufacturing apparatus 100 in accordance with another aspect of the embodiment of the invention.

FIG. 4 is a schematic perspective view of a semiconductor device manufacturing apparatus 200 in accordance with an embodiment of the invention.

FIG. 5 is a schematic perspective view of a semiconductor device manufacturing apparatus 300 in accordance with an embodiment of the invention.

FIG. 6 is a schematic perspective view of a semiconductor device manufacturing apparatus 400 in accordance with an embodiment of the invention.

FIG. 7 is a schematic perspective view of a semiconductor device manufacturing apparatus 500 in accordance with an embodiment of the invention.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Preferred embodiments of the invention are described below with reference to the accompanying drawings. It should be noted that the following embodiments describe examples of the invention.

1. First Embodiment

1.1. Semiconductor Device Manufacturing Apparatus

FIGS. 1 through 3 are schematic perspective views of examples of an apparatus for manufacturing semiconductor devices (hereafter referred to as a semiconductor device manufacturing apparatus) 100 in accordance with an embodiment of the invention. FIG. 4 is a schematic perspective view of an example of a semiconductor device manufacturing apparatus 200 in accordance with an embodiment of the invention. FIG. 5 is a schematic perspective view of an example of a semiconductor device manufacturing apparatus 300 in accordance with an embodiment of the invention.

The semiconductor device manufacturing apparatus 100 includes a cabinet 10, a front door 20, a low oxygen intake port 14, a gas exhaust port 16, a ventilation system 30, a lock system 40, and a detector 50. In the example shown in FIG. 1, as the ventilation system 30, a piping 32 is provided. In the example shown in FIG. 2 and FIG. 3, a suction port 32 is provided as the ventilation system 30.

The cabinet 10 is a housing of the semiconductor device manufacturing apparatus 100 (hereafter referred to as a “manufacturing apparatus 100”). The cabinet 10 has a sealable space (a chamber 11). The cabinet 10 has an opening section 12 of the chamber 11 in its front surface. The chamber 11 is sealingly closed when the front door 20 to be described below is closed, thereby providing an air-tight space therein. The opening section 12 may be provided with a sealing to maintain the air-tightness. The cabinet 10 may be provided with a heater installed inside thereof (not shown) for heating the interior of the chamber 11. When the heater is provided, the cabinet 10 may be provided with an appropriate temperature controlling device or the like. The cabinet 10 in the illustrated example has a cuboid external configuration, but the cabinet 10 may be in any configuration. The size of the cabinet 10 is arbitrary. The material for the cabinet 10 may be, for example, metal, glass and the like. By selecting the quality and rigidity of the composing material for the cabinet 10, the interior of the chamber 11 can be maintained in a pressurized state or a depressurized state. Semiconductor devices are disposed inside the cabinet 10, and shelves and the like may be provided inside thereof, in consideration of the size of the manufacturing apparatus 100, thermal distribution within the chamber 11 and the like, if necessary.

The front door 20 is provided at the front surface of the cabinet 10 in a manner to be freely opened and closed so as to be able to close the opening section 12 in the front surface of the cabinet 10. The front door 20 may be freely opened and closed by hinges, guide rails and the like. In the illustrated example, the front door 20 is provided on the cabinet 10 by using hinges. The front door 20, when closed, can seal the chamber 11 of the cabinet 10. The front door 20 may be provided with a sealing for air-tightness. The front door 20 may be provided with a handle stopper or the like that can fix the front door in a closed state. The front door 20 may be provided with a heater (not shown) mounted therein for heating the interior of the chamber 11. As the material for the front door 20, for example, metal, glass or the like may be used. The front door 20 may be provided with a window made of a transparent material such as glass which allows observation of the interior of the chamber 11 from outside. By selecting the quality and rigidity of the composing material for the front door 20, the interior of the chamber 11 can be maintained in a pressurized state or a depressurized state.

The low oxygen gas intake port 14 is provided on the cabinet 10. The low oxygen gas intake port 14 can introduce nitrogen gas or gas with a lower oxygen concentration than the concentration of oxygen contained in the air atmosphere from outside the cabinet into the chamber 11. The low oxygen gas intake port 14 may be provided at any arbitrary position. The low oxygen gas intake port 14 has a tubular shape for introducing low oxygen gas such as nitrogen into the chamber 11. The low oxygen gas intake port 14 may have an electromagnetic valve or the like. When the low oxygen gas intake port 14 has an electromagnetic valve or the like, a control device may be provided inside the cabinet 10 such that operations to introduce nitrogen or the like can be automatically conducted. In the examples shown in FIG. 1 through FIG. 3, the low oxygen gas intake port 14 is connected to a utility line for nitrogen supply or the like and is provided with a valve 15. The low oxygen gas intake port 14 can introduce nitrogen gas or the like into the chamber 11 to create a low oxygen atmosphere inside the chamber 11 when the front door 20 is closed.

The gas exhaust port 16 is provided on the cabinet 10. The gas exhaust port 16 can exhaust the gas from inside the chamber 11 of the cabinet 10 to the outside the cabinet 10. The gas exhaust port 16 may be provided at any arbitrary position. The gas exhaust port 16 may have a tubular shape. The gas exhaust port 16 may have an electromagnetic valve or the like. The gas exhaust port 16 functions to release and exhaust the air atmosphere or the like from inside the chamber 11 to the outside when nitrogen gas is introduced from the low oxygen gas intake port 14 into the chamber 11. Also, the gas exhaust port 16 functions to release and exhaust nitrogen gas or the like from inside the chamber 11 to the outside when the air atmosphere or the like is introduced from the ventilation system 30 into the chamber 11. In the examples shown in FIG. 1 through FIG. 3, the gas exhaust port 16 is connected to an exhaust line, and is provided with a damper 17. A fan device or the like to forcefully exhaust the gas inside the chamber 11 may be provided at the gas exhaust port 16. Also, the exhaust line to be connected to the gas exhaust port 16 may be, for example, a vacuum line.

The ventilation system 30 is a system for introducing the air atmosphere or oxygen gas into the chamber 11 of the cabinet 10. The ventilation system 30 functions to supply oxygen gas into the chamber 11 when the chamber 11 has a low oxygen atmosphere. The ventilation system 30 may be a ventilation hole 34 provided at the cabinet 10, for example, as shown in FIG. 2. The ventilation system 30 can introduce, for example, compressed air into the chamber 11. Also, the ventilation system 30 can introduce, for example, oxygen gas into the chamber 11. When the ventilation efficiency is poor (when the rate of ventilation is low), it takes a long time to raise the level of oxygen concentration to a predetermined level after the chamber 11 has been placed in a low oxygen atmosphere, and therefore the throughput of the steps that use the manufacturing apparatus 100 lowers. In accordance with the embodiment, the following operations are possible. When a nozzle 32 shown in FIG. 1 is provided as a part of the ventilation system 30, the nozzle 32 may be connected to a compressed air line or the like, whereby the rate of ventilation is increased, and the time required to raise the level of oxygen concentration within the chamber 11 can be shortened. Also, if the nozzle 32 is connected to an oxygen gas line, the time required to raise the level of oxygen concentration within the chamber 11 can be further shortened. When the nozzle 32 that is capable of introducing oxygen containing gas, as shown in FIG. 1, is provided, a valve 33 may be provided. Also, when the ventilation hole 34 is provided, as shown in FIG. 2, for example, a valve 35 that can seal the chamber 11 may be provided. The valve 35 may be in any arbitrary type as long as the air tightness of the chamber 11 can be maintained. Further, a fan or the like for feeding the air atmosphere into the chamber 11 may be provided at the ventilation hole 34. The nozzle 32 and the ventilation hole 34 may be provided at any arbitrary positions.

The ventilation hole 34 may be provided at a lower portion of the chamber 11, as shown in FIG. 3. In the example shown in FIG. 3, another exhaust hole 36 for exhausting the gas within the chamber 11 is provided above the ventilation hole 34. The exhaust hole 36 can exhaust the gas from within the chamber 11 of the cabinet 10 to the outside of the cabinet 10, like the gas exhaust port 16. The exhaust hole 36 may be provided with a valve 37 that is capable of sealing the chamber 11, like the ventilation hole 34. Also, the exhaust hole 36 may be provided with a fan that discharges the gas from within the chamber 11 to the outside. In this manner, the ventilation hole 34 is disposed below the exhaust hole 16, such that, by opening both of the ventilation hole 34 and the exhaust hole 36 when the chamber 11 is filled with nitrogen gas, the air atmosphere can be more effectively introduced into the chamber 11, because the density of nitrogen gas is smaller than the density of the air atmosphere. Also, the ventilation hole 34 and the exhaust hole 36 may be arranged, in consideration of the flow of the gas within the chamber 11, at positions where the ventilation efficiency can be further improved.

The lock system 40 is provided such that the front door 20 can be locked in a closed state. In the examples of the manufacturing apparatus 100 shown in FIG. 1 through FIG. 3, the lock system 40 may be formed from a metal fitting 44 having an opening which is provided on the front door 20, and a bolt-like metal fitting 42 provided on the cabinet 10 at a position corresponding to the metal fitting 44. The lock system 40 may be in any shape as long as the front door 20 can be maintained in a closed state. The lock system 40 may unlock the front door 20 when the oxygen concentration detected by a detector 50 to be described below becomes a predetermined value or higher. The predetermined value of oxygen concentration may be, for example, 18%. The lock system 40 can prevent the front door 20 from opening when the oxygen concentration within the chamber 11 is still low. As the lock system 40, for example, an electromagnetic lock may be used. Also, the lock system 40 may be set such that the lock system 40 locks when the power supply to the manufacturing apparatus 100 stops (i.e., normal lock). The lock system 40 functions, in the steps using the manufacturing apparatus 100, to prevent the operator from opening the front door 20 when the oxygen concentration within the chamber 11 is still low.

The detector 50 may be provided within the chamber 11 of the cabinet 10. The detector 50 can measure the oxygen concentration within the chamber 11. The detector 50 can judge at least as to whether the oxygen concentration within the chamber 11 is less than a predetermined value, or at the predetermined value or higher. The detector 50 can generate signals for controlling the lock system 40. For example, the detector 50 may control the lock system 40 not to unlock when the measured oxygen concentration is less than the predetermined value. The detector 50 may control the lock system 40 to unlock when the measured oxygen concentration is at the predetermined value or higher. The predetermined value of oxygen concentration may be arbitrarily set, and may be set, for example, at 18%. The detector 50 may be provided in an upper portion or a lower portion of the chamber 11, in consideration of the density of gas to be introduced in the chamber 11.

The semiconductor device manufacturing apparatus 100 may be used in the steps of heating, drying and storing in manufacturing semiconductor devices. The heating step using the manufacturing apparatus 100 includes, for example, sintering dielectric material, hardening resist films and the like, and the drying step includes, for example, the step of drying water and various solvents. For the storing step, the manufacturing apparatus 100 may also be used to store various products, semi-products and trial products. Also, the manufacturing apparatus 100 can be used in a state in which the chamber 11 is filled with low oxygen gas such as nitrogen gas, and can also be used in the aforementioned steps while flowing the gas inside thereof.

According to the semiconductor device manufacturing apparatus 100 of the present embodiment, the operator using the manufacturing apparatus 100 cannot open the front door 20 while the chamber 11 is in a state of low oxygen concentration. Therefore the possibility of unexpected accidents such as suffocation of the operator can be considerably minimized. Also, because the lock system 40 is provided, occurrence of misoperations by the operator is extremely scarce. Accordingly, the use of the manufacturing apparatus 100 can ensure that semiconductor devices can be more safely manufactured.

1.2. Modified Example 1

Next, a semiconductor device manufacturing apparatus 200 in accordance with a modified example of the present embodiment is described. The semiconductor device manufacturing apparatus 200 in accordance with the modified example of the present embodiment (hereafter also referred to as a manufacturing apparatus 200) includes a cabinet 10, a front door 20, a low oxygen intake port 14, a gas exhaust port 16, a ventilation system 30, a lock system 40, and a timer 60. The manufacturing apparatus 200 in accordance with the present modified example (as shown in FIG. 4) is equipped with the timer 60 instead of the detector 50 of the manufacturing apparatus 100 (as shown in FIG. 2). Operations other than those of the timer 60 and the lock system 40 are generally the same as those of the manufacturing apparatus 100, and therefore the similar members are referenced with like reference numerals and their detailed description shall be omitted. In the example shown in FIG. 4, as the ventilation system 30, a ventilation hole 34 for introducing the air atmosphere into the cabinet 10 is provided.

The timer 60 may be provided, for example, on the cabinet 10. The timer 60 may start time measurement when the ventilation system 30 starts operation. The timer 60 may be set such that the time measurement can be started manually by the operator when the operator starts the ventilation system 30. It would be more desirable if the timer 60 starts the time measurement, synchronized with the start of operation of the ventilation system 30, in order to eliminate man-made mistakes by the operator. The timer 60 is capable of judging as to whether a predetermined time has elapsed. The predetermined time may be the time required by the operation of the ventilation system 30 for introducing enough oxygen to the level at which the person in the chamber 11 would not be suffocated. Such predetermined time may be decided by calculation and/or experiment in advance, using the manufacturing apparatus 200. The timer 60 may generate signals for controlling the lock system 40. For example, the timer 60 may control the lock system 40 not to unlock when the measured time does not reach the predetermined time. The timer 60 may control the lock system 40 to unlock when the measured time reaches the predetermined time.

The lock system 40 can unlock when the time measured by the timer 60 reaches the predetermined time. The lock system 40 prevents the front door 20 from opening in a state in which the oxygen concentration in the chamber 11 is low. The lock system 40 functions in a manner that, in the steps using the manufacturing apparatus 200, the front door 20 cannot be opened by the operator when the oxygen concentration in the chamber 11 is low.

According to the semiconductor device manufacturing apparatus 200 described above, the operator using the manufacturing apparatus 200 would not be able to open the front door 20 while the chamber 11 is in a low oxygen concentration state. Therefore, the possibility of unexpected accidents such as suffocation of the operator can be reduced to an extremely low level. Also, due to the provision of the lock system 40, misoperations by the operator would rarely occur. Accordingly, by using the manufacturing apparatus 200, semiconductor devices can be more safely manufactured.

1.3. Modified Example 2

Next, a semiconductor device manufacturing apparatus 300 in accordance with a modified example of the embodiment of the invention is described. The semiconductor device manufacturing apparatus 300 in accordance with the modified example of the embodiment (hereafter also referred to as a manufacturing apparatus 300) includes a cabinet 10, a front door 20, a low oxygen intake port 14, a gas exhaust port 16, a ventilation system 30, a detector 50, and an alarm device 70. The manufacturing apparatus 300 in accordance with the present modified example (as shown in FIG. 5) is equipped with the alarm device 70, instead of the lock system 40 of the manufacturing apparatus 100 (as shown in FIG. 2). The manufacturing apparatus 300 is generally the same as the manufacturing apparatus 100 except the alarm device 70, and therefore similar members shall be referenced with like reference numbers, and their detailed description shall be omitted.

The alarm device 70 may be provided on an external surface of the cabinet 10. The alarm device 70 may be equipped with, for example, a rumbling generation device such as a buzzer, a light emission device such as a lamp and the like. The alarm device 70 can warn operators who use the manufacturing apparatus 300 through rumbling of the buzzer, light flashing operation of the lamp and the like. The alarm device 70 may be set to operate when the interior of the chamber 11 is in a low oxygen atmosphere. Conversely, the alarm device 70 may be set to operate when enough oxygen is introduced in the chamber to the level at which the operator does not suffocate.

The alarm device 70 may be operated, for example, when the oxygen concentration detected by the detector 50 becomes 18% or higher. Also, the alarm device 70 may be operated, for example, when the time measured by the timer 60 reaches a predetermined time. As a result, the operator can be warned by the alarm device 70, and the front door 30 can be prevented from being opened when the oxygen concentration inside the chamber 11 is low. The alarm device 70 functions in a manner that, in the steps using the manufacturing apparatus 300, the operator is alarmed so as not to open the front door 20 when the oxygen concentration in the chamber 11 is low.

The semiconductor device manufacturing apparatus 300 described above functions in a manner that the operator using the manufacturing apparatus 300 is alarmed so as not to open the front door 20 in a state in which the oxygen concentration in the chamber 11 is low. Therefore, the possibility of unexpected accidents such as suffocation of the operator can be reduced to an extremely low level. Accordingly, by using the manufacturing apparatus 300, semiconductor devices can be more safely manufactured.

2. Second Embodiment

2.1. Semiconductor Device Manufacturing Apparatus

FIG. 6 is a schematic perspective view of a semiconductor device manufacturing apparatus 400 in accordance with an embodiment of the invention. FIG. 7 is a schematic perspective view of a semiconductor device manufacturing apparatus 500 in accordance with an embodiment of the invention.

The semiconductor device manufacturing apparatus 400 in accordance with the present embodiment (hereafter also referred to as a manufacturing apparatus 400) includes a cabinet 10, a front door 20, a low oxygen intake port 14, a gas exhaust port 16, a mesh door 80, a detector 50 and a lock system 40. The manufacturing apparatus 400 in accordance with the present embodiment (as shown in FIG. 6) is generally the same as the manufacturing apparatus 100 in accordance with the first embodiment (as shown in FIGS. 1 through 3) except that it does not have a ventilation system 40 but is equipped with the mesh door 80, and the lock system 40 is provided on the mesh door 80, not on the front door 20. Similar members are referenced with like reference numerals, and their detailed description shall be omitted.

The mesh door 80 is provided at the opening section 12 on the front surface of the cabinet 10 in a manner to be freely opened and closed. The mesh door 80 may be installed, for example, by hinges as shown in the illustrated example, so as to be freely opened and closed. The mesh door 80 has a mesh section 84 with a mesh size that prevents an object of the size as large as the human head from entering the chamber 11 of the cabinet 10 when it is closed. The mesh door 80 can allow gases to pass through. The mesh door 80 may be provided with a handle stopper or the like that can fix the mesh door 80 in a closed state. The mesh door 80 may be formed from, for example, a metal frame 82 and a metal mesh, a resin mesh or the like attached to the frame 82. The mesh section of the mesh door 80 may preferably be large in area so that gases inside the chamber 11 or the air atmosphere outside can readily diffuse through the mesh section. Also, it is desired for the mesh door 80 to have a sufficient strength so as not to be damaged when an object such as the head of the operator entering the chamber 11 hits the mesh door 80. The mesh door 80 may use a mesh with a mesh size that allows observation of the interior of the chamber 11 from outside. The mesh door 80 can replace the gas inside the chamber 11 with the air atmosphere when the front door 20 is open.

The lock system 40 in accordance with the present embodiment is provided in a manner to lock the mesh door 80 in a closed state. In the examples of the manufacturing apparatus 400 and the manufacturing apparatus 500 shown in FIG. 6 and FIG. 7, the lock system 40 may be formed from a metal fitting 44 having an opening which is provided on the mesh door 80, and a bolt-like metal fitting 42 provided on the cabinet 10 at a position corresponding to the metal fitting 44. The lock system 40 may have any shape as long as the mesh door 80 can be maintained in a closed state. In accordance with the present embodiment, the lock system 40 can prevent a part of the body of the operator from entering the chamber 11 even when the front door 20 is open. The lock system 40 functions, in the steps using the manufacturing apparatus 400 or the manufacturing apparatus 500, to prevent a part of the operator's body from entering the chamber 11 even when the operator opens the front door 20 when the oxygen concentration within the chamber 11 is still low.

The manufacturing apparatus 400 in accordance with the present embodiment shown in FIG. 6 has a detector 50. The detector 50 can control the lock system 40 not to unlock when the oxygen concentration measured is less than a predetermined value (for example, 18%). The detector 50 can also control the lock system 40 to unlock when the oxygen concentration measured is at the predetermined value (for example, 18%) or higher.

Because the semiconductor device manufacturing apparatus 400 described above has the mesh door 80, the operator using the manufacturing apparatus 400 is prevented from moving a part of his body into the chamber 11 when the chamber 11 is in a low oxygen concentration state. Therefore the possibility of unexpected accidents such as suffocation of the operator can be reduced to an extremely small level. Also, the mesh door 80 in its closed state can allow the chamber 11 to be ventilated, such that the ventilation system 30 described in conjunction with the first embodiment is not necessarily required. However, it is noted that there is no restriction in adding other structures to the manufacturing apparatus 400, such as, the ventilation system 30 described in conjunction with the first embodiment. By using the manufacturing apparatus 400, semiconductor devices can be safely manufactured.

The manufacturing apparatus 500 in accordance with the present embodiment shown in FIG. 7 is equipped with the timer 60. The timer of the present embodiment can start time measurement at the time when the front door 20 is opened. Time measurement by the timer 60 can be started manually by the operator when the operator opens the front door 20. It would be more desirable if the timer 60 starts the time measurement, synchronized with opening of the front door 20, in order to eliminate man-made mistakes by the operator. The timer 60 is capable of judging as to whether a predetermined time has elapsed. The predetermined time may be the time required for introducing enough oxygen into the chamber 11 at least through the mesh door 80 when the front door 20 is opened to the level at which the operator in the chamber 11 would not be suffocated. Such predetermined time may be decided by calculation and/or experiment in advance, using the manufacturing apparatus 500. The timer 60 may generate signals for controlling the lock system 40. For example, the timer 60 can control the lock system 40 not to unlock when the measured time does not reach the predetermined time. The timer 60 can control the lock system 40 to unlock when the measured time reaches the predetermined time.

According to the semiconductor device manufacturing apparatus 500 described above, the operator using the manufacturing apparatus 500 is prevented from opening the mesh door 80 when the chamber 11 is in a low oxygen concentration state. Therefore the possibility of unexpected accidents such as suffocation of the operator can be reduced to an extremely small level. Accordingly, the use of the manufacturing apparatus 500 can ensure that semiconductor devices can be more safely manufactured.

The semiconductor device manufacturing apparatus in accordance with the present embodiment can appropriately incorporate the structures described in conjunction with the first embodiment. As a result, the safety of the operators can be further improved.

3. Semiconductor Device Manufacturing Method

In manufacturing semiconductor devices, the individual unit operations of heating, drying and storing the semiconductor devices are frequently conducted. An oven (heating/drying furnace) and a desiccator (a storage container) are often used for such individual operations. Depending on the types of semiconductor devices, these steps may be conducted in the apparatuses while gas with a low oxygen concentration is flowed or sealed inside the apparatuses (in an oxygen-deficient atmosphere).

By using the semiconductor device manufacturing apparatus in accordance with any one of the embodiments of the invention described above when conducting such individual operations, the possibility of unexpected accidents such as suffocation of the operator can be reduced to an extremely small level. For this reason, by using the manufacturing apparatus in accordance with any one of the embodiments described above, the individual unit operations can be more safely conducted, and semiconductor devices can be more safely manufactured, than the apparatuses in related art.

The invention is not limited to the embodiments described above, and many more modifications can be made. For example, the invention may include compositions that are substantially the same as the compositions described in the embodiments (for example, a composition with the same function, method and result, or a composition with the same objects and result). Also, the invention includes compositions in which portions not essential in the compositions described in the embodiments are replaced with others. Also, the invention includes compositions that achieve the same functions and effects or achieve the same objects of those of the compositions described in the embodiments. Furthermore, the invention includes compositions that include publicly known technology added to the compositions described in the embodiments.

The entire disclosure of Japanese Patent Application No: 2008-008926, filed Jan. 18, 2008 and 2008-194491, filed Jul. 29, 2008 are expressly incorporated by reference herein. 

1. An apparatus for manufacturing semiconductor devices, comprising: a cabinet having an opening section on a front surface thereof; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in an air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a ventilation system that introduces the air atmosphere or oxygen into the cabinet; a lock system that is capable of locking the front door in a closed state; and a detector that detects oxygen concentration within the cabinet, wherein the lock system unlocks the front door when the oxygen concentration detected by the detector becomes a predetermined value or higher.
 2. An apparatus for manufacturing semiconductor devices, comprising: a cabinet having an opening section on a front surface thereof; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in an air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a ventilation system that introduces the air atmosphere or oxygen into the cabinet; a lock system that is capable of locking the front door in a closed state; and a timer that starts time measurement upon operation of the ventilation system, wherein the lock system unlocks the front door when a time measured by the timer reaches a predetermined time.
 3. An apparatus for manufacturing semiconductor devices, comprising: a cabinet having an opening section on a front surface thereof; a front door that is provided at the opening section of the cabinet in a manner to be freely opened and closed; a low oxygen gas intake port for introducing nitrogen gas or gas with an oxygen concentration lower than a concentration of oxygen contained in an air atmosphere; a gas exhaust port for exhausting the gas from within the cabinet; a mesh door that is provided at the opening section of the cabinet in a manner to be freely opened and closed, and provided inside the front door; a detector that detects an oxygen concentration within the cabinet; and a lock system that is capable of locking the mesh door in a closed state, wherein the lock system unlocks the mesh door when the oxygen concentration detected by the detector becomes a predetermined value or higher.
 4. An apparatus for manufacturing semiconductor devices according to claim 1, wherein an alarm device is provided instead of the lock system, and the alarm device alarms when the oxygen concentration detected by the detector becomes a predetermined value or higher.
 5. An apparatus for manufacturing semiconductor devices according to claim 2, wherein an alarm device is provided instead of the lock system, and the alarm device alarms when the time measured by the timer reaches a predetermined time.
 6. An apparatus for manufacturing semiconductor devices according to claim 3, further comprising a ventilation system for introducing the air atmosphere or oxygen into the cabinet.
 7. An apparatus for manufacturing semiconductor devices according to claim 1, wherein the ventilation system includes at least one of a compressed air jet nozzle and an air atmosphere intake port equipped with a suction fan.
 8. An apparatus for manufacturing semiconductor devices according to claim 7, wherein the ventilation system includes an exhaust fan provided at the gas exhaust port.
 9. An apparatus for manufacturing semiconductor devices according to claim 8, wherein the exhaust fan is provided at a position higher than a position of the suction fan within the cabinet. 